Thermal Oxide Wafer: 300 nm SiO2 Layer on Si (100), 3"dia x 0.50 mm t,undoped N type, 1SP R:>1000 ohm.cm
Thermal Oxide Wafer: 300 nm SiO2 Layer on Si (100), 3"dia x 0.50 mm t,undoped N type, 1SP R:>1000 ohm.cm
53 in stock
SKU: : \Fm300SOonSiUa76D05C1R1000US
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Thermal oxide Layer
-
Research Grade , about 80 % useful area
- SiO2 layer on 3" Silicon wafer
- Oxide layer thickness: 300 nm ( 3000A) +/-10%
- Refractive index - 1.455
Silicon Wafer Specifications:
- Conductive type: N-type/ un-dped
- Resistivity: >1000 ohm.cm
- Size: 3"diameter +/- 0.5 mm x 0.5 mm
- Orientation: (100) +/- 1o
- Polish: one side polished
- Surface roughness, Ra: < 5A (RMS)
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