GaAs, VGF-grown (100) Si-doped, N-type, 2" Dia x 0.35mm, 2sp - GASia50D035C2US5
GaAs, VGF-grown (100) Si-doped, N-type, 2" Dia x 0.35mm, 2sp - GASia50D035C2US5
Minimum Order: $20 (equipment), $100 (crystals)
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SKU: : \GASia50D035C2US5
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The Silicon-Doped Gallium Arsenide (GaAs) Single Crystal Wafer is a 2-inch-diameter, N-type conductive semiconductor substrate grown using the Vertical Gradient Freeze (VGF) method. It features a (100) crystal orientation, a thickness of 0.35 mm, and a double-side-polished (DSP) surface.
This Si-doped GaAs wafer has a carrier concentration of (1.60–3.94) × 1018 cm-3, carrier mobility of 1400–2100 cm2/(V·s), and resistivity of (1.08–1.90) × 10-3 Ω·cm. With an average surface roughness (Ra) below 0.4 nm and EPI-ready surface preparation and packing, it is suitable for epitaxial growth, semiconductor research, and thin-film deposition applications.
SPECIFICATIONS
| Product Type | Gallium Arsenide (GaAs) Single Crystal Wafer |
| Material | Gallium Arsenide (GaAs) |
| Crystal Growth Method | Vertical Gradient Freeze (VGF) |
| Crystal Orientation | (100) |
| Wafer Diameter | 2 inches (approximately 50.8 mm) |
| Wafer Thickness | 0.35 mm |
| Surface Polishing | Double-side polished (DSP) |
| Doping | Silicon-doped (Si-doped) |
| Electrical Type | N-type conductive |
| Carrier Concentration | (1.60–3.94) × 1018 cm-3 |
| Carrier Mobility | 1400–2100 cm2/(V·s) |
| Resistivity | (1.08–1.90) × 10-3 Ω·cm |
| Etch Pit Density (EPD) | < 500 (source lists cm2; unit requires confirmation, as EPD is conventionally expressed in cm-2) |
| Average Surface Roughness (Ra) | < 0.4 nm |
| Surface Preparation & Packing | EPI-ready surface and packing |
| Features & Applications |
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