1" Copper Backing Plate - EQ-CBP-1

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Total Solution for Materials ResearchDosing, Mixing, Pressing, Firing, Melting, Cutting, Polishing, Coating, Testing, and Automation Integration

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$180.00 USD

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SKU: : \EQ-CBP-1

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Copper Backing Plate is used for improving the conductivity of the nonmetallic plasma sputtering targets.

SPECIFICATION

Chemical Symbol	Copper
Thickness	2.3 mm
Weight	1 oz
Color	Reddish Brown
Application Notes	Used for bonding with nonmetallic sputtering targets.
Operation Instructions

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