Features:

• A plane (11-20)  sapphire wafer 
  
• Wafer size: 100 mm dia x 0.5 mm thickness 
• Orientaion: A plane <11-20>  ori.( +/- 0.5^o) with Standard Flat
• Polished surface: Wafer surface is EPI polished via a special CMP procedure  
• Package: Each wafer is packed in 1000 class clean room with 100 grade plastic bag with wafer container

Typical Properties:

• Crystal Structure: Hexagonal. a=4.758 Angstroms c=12.99 Angstroms
• Melting Point: 2040 degree C
• Density: 3.97 gram/cm² 
• Growth Technique: CZ
• Crystal Purity: >99.99%
• Hardness:  9 ( mohs)
• Thermal Expansion:  7.5x10^{-6 (}/ ^oC)
• Thermal Conductivity: 46.06 @ 0 ^oC    25.12 @ 100 ^oC, 12.56 @ 400 ^oC   ( W/(m.K) )
• Dielectric Constant: ~ 9.4 @300K  at A axis ~ 11.58@ 300K at C axis
• Loss Tangent at 10 GHz: < 2x10^-5  at A axis,  <5 x10^-5  at C axis

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