Thermal Oxide Wafer: 300 nm SiO2 Layer on Si (111), 4"dia x 0.525 mm t, N-type, Sb-doped 1SP R: 0.01-0.02 ohm.cm - Fm300SOonSISbc101D0525C1R001
Thermal Oxide Wafer: 300 nm SiO2 Layer on Si (111), 4"dia x 0.525 mm t, N-type, Sb-doped 1SP R: 0.01-0.02 ohm.cm - Fm300SOonSISbc101D0525C1R001
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$94.95 USD
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SKU: : \Fm300SOonSISbc101D0525C1R001
Thermal oxide Layer
-
Research Grade, about 80% useful area
- SiO2 layer on 4"Silicon wafer
- Oxide layer thickness: 300 nm (3000A) +/-10%
- Refractive index - 1.455
Silicon Wafer Specifications:
- Conductive type: N-type/ Sb-dped
- Resistivity: 0.01- 0.02 ohm.cm (If you would like to measure the resistivity accurately,
please order our Portable 4 Probe Resistivity Testing Instrument.) - Size: 4" +/- 0.5 mm x 0.525 mmth
- Orientation: (111) +/- 0.5o
- Polish: one side polished
- Surface roughness, Ra: < 5A (RMS)
Optional: you may need tool below to handle the wafer ( click picture to order )
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