VTC-16-3HD-LD is a compact three rotary target plasma sputtering coater with a touch screen digital controller, and a substrate heater capable of heating up to 500 °C. It can coat 1- 3 types of metallic materials to sample with a diameter up to 50 mm. Three sputtering targets: gold, silver, and copper are included for immediate use.
SPECIFICATIONS:
Input Power
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- Single-phase 220 VAC, 50 / 60Hz
- 700 W (not including vacuum pump)
- For using under 110 VAC, a 1500W transformer will be needed.
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| Output Power |
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Vacuum Chamber
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Sample Stage
 
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- Stage size: 50 mm Dia.
- Sputtering distance range: 25 – 40 mm adjustable
- Rotatable stage with three sputtering positions (controlled by the touch screen)
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| Optional Heater for Sample Stage |
- The Substrate Heater has a maximum heating temperature of 500°C.
- PID temperature controller with +/- 1°C accuracy is integrated into the touchscreen.
- Please select from the options bar.
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Control Panel
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- 6” color touch screen with PLC integration for easy operation
- The vacuum gauge, sputtering current meter, and substrate temperature control are integrated into the touchscreen panel
- Adjustment knobs on the front panel for gas intake and sputtering current control
- Sputtering position, sputtering timer, and process logging are accessible from the touchscreen
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Shield
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- Stainless steel shield cage is included for extra protection
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Sputtering Targets
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- Target size requirements: 47 mm Dia. x 2.5 mm max
- It also can coat Ag, Al, Cr, Ni, Pt, Ti, Sn, Li, Mg, etc. Almost every kind of metallic material.
- Warning Aluminum, Chromium or Nickel Target can be coated by this machine, but please review the Recommend Coating Method before using.
- Please RF Plasma Megnetron Sputtering for coating Alumina
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Vacuum Pump
(Optional)
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- Built-in KF25 vacuum port for connecting to a vacuum pump (Pic #1)
- A vacuum pump with a KF25 connector is required, but not included. User may choose
- The vacuum pump can be plugged into the power outlet on the left of the coater for automatic control
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Dimensions
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| Net Weight |
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| Compliance |
- CE approval
- NRTL certification is NOT available temporarily.
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Application Notes
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- For the best film-substrate adhesion strength, please clean the substrate surface before coating:
- Ultrasonic cleaning (Click the picture below to order) with the following sequential baths - (1) acetone, (2) isopropyl alcohol - to remove oil and grease. Blow dry the substrate with N2, then hot bake in a vacuum to remove absorbed moisture
- Plasma cleaning (Click the picture below to order) may be needed for surface roughening, surface chemical bonds activation, or additional contamination removal
- A thin buffer layer (~5 nm), such as Cr, Ti, Mo, Ta, could be applied to improve the adhesion of metals and alloys
- A two-stage pressure regulator (not included) should be installed on the gas cylinder to limit the output pressure of the gas to below 0.02 MPa for safe usage. Please use > 5N purity Ar gas for plasma sputtering
- HIGH VOLTAGE! Sputtering heads connect to high voltage. For safety, the operator must shut down the equipment before sample loading and target changing operations
- This model is not suitable for coating light metallic materials such as Al, Mg, Zn, Ni, etc. due to its low energy. Please consider our magnetron sputtering coater or thermal evaporation coater. Click the pictures below for detail
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Ultrasonic Cleaner
Plasma Cleaner
Magnetron Sputtering
Thermal Evaporation