Fearures:

• R plane -- (1-102) orientation sapphire wafer is being used  as a superconductor substrate due to less mis-matched lattice and stable chemical and physical properties. 
• Wafer size:   3" dia x  0.5 mm thickness 
• (1-102) R-plane orientation +/-0.5 Deg, orientation with 45 degree counter-clockwise from the projection of C-axis onto the R-plane
  
• Polished surface:   Wafer surface is EPI polished via a special CMP procedure. 
• One side polished
• Package:    Each wafer is packed in 1000 class clean room with 100 grade plastic bag with wafer container.
• Precaution:   R plane sapphire wafer is easy to cleave compared with C plane's. Please handle it with a care

Typical Properties:

•  Crystal Structure:      Hexagonal. a=4.758 Angstroms c=12.99 Angstroms,
• Melting Point: 2040 degree C
• Density: 3.97 gram/cm² 
• Growth Technique: CZ
• crystal purity:             >99.99%
• Hardness:                   9 ( mohs)
• Thermal Expansion:    7.5x10^{-6 (}/ ^oC)
• Thermal Conductivity: 46.06 @ 0 ^oC     25.12 @ 100 ^oC,     12.56 @ 400 ^oC   ( W/(m.K) )
• Dielectric Constant: ~ 9.4 @300K  at A axis ~ 11.58@ 300K at C axis
• Loss Tangent at 10 GHz: < 2x10^-5  at A axis ,  <5 x10^-5  at C axis

 Please click here for detail data

A-plane (11-20)	C-Plane (0001)	M-Plane (1-100)	R-Plane (1-102)	Al2O3(10-14)