• BiFeO3 Target > 99.99%, 3" Dia x 0.125" Thick bond to Copper(Cu) backing plate(0.111" thick)
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BiFeO3 Target > 99.99%, 3" Dia x 0.125" Thick bond to Copper(Cu) backing plate(0.111" thick)

BiFeO3 Target > 99.99%, 3" Dia x 0.125" Thick bond to Copper(Cu) backing plate(0.111" thick)

Low stock: 1 left

$1,295.00 USD
$1,295.00 USD
Sale Email for Lead Time

SKU: TGTBFO76D3175TCuPlateUS5
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  • Composition:    Bismuth Iron Oxide BiFeO3  Target
  • 3" Dia x 0.125" Thick bond to Copper(Cu) backing plate(0.111" thick)
  •  Purity:            > 99.99%


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