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DC/RF Dual-Head High Vacuum 2” Magnetron Plasma Sputtering Coater - VTC-600-2HD-LD

DC/RF Dual-Head High Vacuum 2” Magnetron Plasma Sputtering Coater - VTC-600-2HD-LD

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SKU: : \VTC600HD2

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VTC-600-2HD-LD is a compact magnetron sputtering system with dual 2" target sources, e.g., one DC source for coating metallic film, and the other RF source for coating non-metallic material. This coating system is designed for coating both single or multiple film layers for a wide range of materials, such as alloy, ferroelectric, semiconductor, ceramic, dielectric, optical, PTFE, etc. (Revised since 9/25/2015.  Film Thickness Monitor is not included.)

SPECIFICATIONS

Compact Structure
          

Input Power
  • Single-phase 220 VAC 50 / 60 Hz
  • 2000 W (including a vacuum pump and water chiller)



Source Power

  • Two sputtering power sources are integrated into one control box (Click the picture below to see detailed specs)
    • DC source: 500 W power for coating metallic materials (Pic 1)
    • RF source: 300 W power, 13.56 MHz frequency for coating non-conductive materials (Pic 2)
          -- Pic 1           -- Pic 2     






Magnetron Sputtering Head

  • Two 2" Magnetron Sputtering Heads with water cooling jackets and shutters are included (Click Pic. 1)
  • Customized coater:
  • Two DC heads without RF; two RF heads without DC; 3 RF heads are available upon request
  • Optional: 148 cm RF cable can be ordered at extra cost for the replacement (Click the pic below to order)
  • Four heads sputtering system is available upon request  (Pic. 5)
          Pic. 1     Pic. 2   Pic. 3        Pic. 4    Pic. 5




Vacuum Chamber

  • Vacuum chamber: 300 mm Dia. x 300 mm Height, made of stainless steel
  • Viewport: Two pieces of 100 mm Dia. glass. One fixed; one detachable for cleaning and replacement
  • Hinged type lid with pneumatic power pole allows easy target change
                    



Sample Stage

  • The sample holder is a rotatable and heatable stage made of the ceramic heater with copper cover
  • Sample holder size: 140 mm Dia. for. 4" wafer max
  • Rotation speed: 1 - 20 rpm adjustable for uniform coating
  • The holder temperature is adjustable from RT to 500 °C max (2 hr max) with accuracy +/- 1.0 °C via a digital temperature controller
                          

Gas Flow Control

  • Two precision mass flow controllers (MFC) are installed to allow inlet of two types of gasses 
    • Flow rate: 0 – 200 mL/min adjustable on the touch screen control panel
  • Air inlet valve is installed for vacuum release
Vacuum Pump Station
  
  • A mobile pump station with a rotary vane pump is included. The sputtering coater can be placed on top of the station
  • For vacuum <4E-5 Torr, a 63 L/s turbomolecular pump is optional. 
  • For vacuum <1E-5 Torr, a 260 L/s turbomolecular pump is optional.
  • High vacuum condition is required for targets sensitive to oxygen, such as Al, Ti, Cr, etc. 
  •        
Water Chiller
  • One digital temperature-controlled recirculating water chiller is included.
    • Refrigeration range: 5~35 °C
    • Flow rate: 16 L/min
    • Pump pressure: 14 psi
    Film Thickness Monitor 
    (Option )
       
    • Precise quartz Film Thickness Monitor is optional, which is used for in-situ thickness measurement. Accuracy up to 1Å
    • Precision Thin Film & Coating Analysis Systems - EQ-TFMS-LD is available at an extra cost
    • Various 2” oxide and metallic targets are available upon request at extra cost. Silver epoxy and copper backing plates can be ordered at MTI


    Overall Dimensions

              Lid closed: 48" × 28" × 32"                              Lid open: 48" × 28" × 37"

    Net Weight of Coater

    • 160 kg

    Shipping Weight & Dimensions

    • Total 2 Pallets
      • #1: 520 lbs, 52" x 40" x 50"
      • #2: 420 lbs, 48" x 40" x 45"

    Compliance

    • CE approval
    • NRTL Certification (UL 1450) is available upon request at extra cost
                  

    Warranty

    • One-year limited warranty with lifetime support


    Operation Demo Video

                             

     Application Notes

                

    • A two-stage pressure regulator should be installed on the gas tank to limit the output pressure below 0.02 MPa.
    • Please use > 5N purity Argon gas for plasma sputtering. 
    • For best performance, the non-conductive targets must be installed with a copper backing plate. Please refer to the instruction video below for target bonding (Click Pic #3 below)
    • MTI supplies single crystal substrate from A to Z (Click Pic #4 below to order) 
    • MTI Sputtering Coaters have successfully coated ZnO on Al2O3 substrate at 500 °C (XRD profile in Pic #5 below)
    • HIGH VOLTAGE! Sputtering heads connect to high voltage. For safety, the operator must shut down the RF / DC generator before sample loading and target changing operations
    • DO NOT use DI water in a water chiller. Use coolant, distilled water, or anti-corrosive additives with water
    • The coater can be placed into glovebox as the Pic. 6 at extra cost ( must order glovebox together)
    •  Pic 3  Pic 4  Pic 5 Pic. 6
    Manufacturer Part Number: