VTC-600-2HD-LD is a compact magnetron sputtering system with dual 2" target sources, e.g., one DC source for coating metallic film, and the other RF source for coating non-metallic material. This coating system is designed for coating both single or multiple film layers for a wide range of materials, such as alloy, ferroelectric, semiconductor, ceramic, dielectric, optical, PTFE, etc. (Revised since 9/25/2015. Film Thickness Monitor is not included.)
SPECIFICATIONS
Compact Structure |
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Input Power |
- Single-phase 220 VAC 50 / 60 Hz
- 2000 W (including a vacuum pump and water chiller)
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Source Power
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- Two sputtering power sources are integrated into one control box (Click the picture below to see detailed specs)
- DC source: 500 W power for coating metallic materials (Pic 1)
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RF source: 300 W power, 13.56 MHz frequency for coating non-conductive materials (Pic 2)
-- Pic 1 -- Pic 2
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Magnetron Sputtering Head
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Two 2" Magnetron Sputtering Heads with water cooling jackets and shutters are included (Click Pic. 1)
- Customized coater:
- Two DC heads without RF; two RF heads without DC; 3 RF heads are available upon request
- Optional: 148 cm RF cable can be ordered at extra cost for the replacement (Click the pic below to order)
- Four heads sputtering system is available upon request (Pic. 5)
Pic. 1 Pic. 2 Pic. 3 Pic. 4 Pic. 5
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Vacuum Chamber
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- Vacuum chamber: 300 mm Dia. x 300 mm Height, made of stainless steel
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Viewport: Two pieces of 100 mm Dia. glass. One fixed; one detachable for cleaning and replacement
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Hinged type lid with pneumatic power pole allows easy target change
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Sample Stage
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- The sample holder is a rotatable and heatable stage made of the ceramic heater with copper cover
- Sample holder size: 140 mm Dia. for. 4" wafer max
- Rotation speed: 1 - 20 rpm adjustable for uniform coating
- The holder temperature is adjustable from RT to 500 °C max (2 hr max) with accuracy +/- 1.0 °C via a digital temperature controller
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Gas Flow Control
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Two precision mass flow controllers (MFC) are installed to allow inlet of two types of gasses
- Flow rate: 0 – 200 mL/min adjustable on the touch screen control panel
- Air inlet valve is installed for vacuum release
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Vacuum Pump Station
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- A mobile pump station with a rotary vane pump is included. The sputtering coater can be placed on top of the station
- For vacuum <4E-5 Torr, a 63 L/s turbomolecular pump is optional.
- For vacuum <1E-5 Torr, a 260 L/s turbomolecular pump is optional.
- High vacuum condition is required for targets sensitive to oxygen, such as Al, Ti, Cr, etc.
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Water Chiller
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- One digital temperature-controlled recirculating water chiller is included.
- Refrigeration range: 5~35 °C
- Flow rate: 16 L/min
- Pump pressure: 14 psi
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Film Thickness Monitor (Option )
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Overall Dimensions
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Lid closed: 48" × 28" × 32" Lid open: 48" × 28" × 37"
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Net Weight of Coater |
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Shipping Weight & Dimensions |
- Total 2 Pallets
- #1: 520 lbs, 52" x 40" x 50"
- #2: 420 lbs, 48" x 40" x 45"
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Compliance
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- CE approval
- NRTL Certification (UL 1450) is available upon request at extra cost
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Warranty |
- One-year limited warranty with lifetime support
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Operation Demo Video
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Application Notes
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A two-stage pressure regulator should be installed on the gas tank to limit the output pressure below 0.02 MPa.
- Please use > 5N purity Argon gas for plasma sputtering.
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For best performance, the non-conductive targets must be installed with a copper backing plate. Please refer to the instruction video below for target bonding (Click Pic #3 below)
- MTI supplies single crystal substrate from A to Z (Click Pic #4 below to order)
- MTI Sputtering Coaters have successfully coated ZnO on Al2O3 substrate at 500 °C (XRD profile in Pic #5 below)
- HIGH VOLTAGE! Sputtering heads connect to high voltage. For safety, the operator must shut down the RF / DC generator before sample loading and target changing operations
- DO NOT use DI water in a water chiller. Use coolant, distilled water, or anti-corrosive additives with water
- The coater can be placed into glovebox as the Pic. 6 at extra cost ( must order glovebox together)
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