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GaAs, VGF-grown (100) Si-doped, N-type, 2" Dia x 0.35mm, 2sp - GASia50D035C2US5

GaAs, VGF-grown (100) Si-doped, N-type, 2" Dia x 0.35mm, 2sp - GASia50D035C2US5

Minimum Order: $20 (equipment), $100 (crystals)

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17 in stock

Regular price $595.00 USD
Regular price Sale price $595.00 USD
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SKU:  : \GASia50D035C2US5

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The Silicon-Doped Gallium Arsenide (GaAs) Single Crystal Wafer is a 2-inch-diameter, N-type conductive semiconductor substrate grown using the Vertical Gradient Freeze (VGF) method. It features a (100) crystal orientation, a thickness of 0.35 mm, and a double-side-polished (DSP) surface.

This Si-doped GaAs wafer has a carrier concentration of (1.60–3.94) × 1018 cm-3, carrier mobility of 1400–2100 cm2/(V·s), and resistivity of (1.08–1.90) × 10-3 Ω·cm. With an average surface roughness (Ra) below 0.4 nm and EPI-ready surface preparation and packing, it is suitable for epitaxial growth, semiconductor research, and thin-film deposition applications.

SPECIFICATIONS

Product Type Gallium Arsenide (GaAs) Single Crystal Wafer
Material Gallium Arsenide (GaAs)
Crystal Growth Method Vertical Gradient Freeze (VGF)
Crystal Orientation (100)
Wafer Diameter 2 inches (approximately 50.8 mm)
Wafer Thickness 0.35 mm
Surface Polishing Double-side polished (DSP)
Doping Silicon-doped (Si-doped)
Electrical Type N-type conductive
Carrier Concentration (1.60–3.94) × 1018 cm-3
Carrier Mobility 1400–2100 cm2/(V·s)
Resistivity (1.08–1.90) × 10-3 Ω·cm
Etch Pit Density (EPD) < 500 (source lists cm2; unit requires confirmation, as EPD is conventionally expressed in cm-2)
Average Surface Roughness (Ra) < 0.4 nm
Surface Preparation & Packing EPI-ready surface and packing
Features & Applications
  • VGF-grown GaAs single crystal substrate.
  • (100) crystallographic orientation.
  • Silicon-doped, N-type conductive semiconductor material.
  • 2-inch diameter and 0.35 mm thickness.
  • Double-side-polished surface.
  • Carrier concentration of (1.60–3.94) × 1018 cm-3
  • Carrier mobility of 1400–2100 cm2/(V·s).
  • Average surface roughness below 0.4 nm.
  • EPI-ready surface preparation and packing.
  • Suitable for epitaxial growth, semiconductor research, and thin-film deposition.


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