Wafer Specifications:. 

• Size:                      2" diameter x 0.5mm,
• Orientation:          (100)
• Dopping:              undoped,
• Conducting type: P-type.
• Polish:                   two sides polished by CMP
• Roughness:         < 0.5nm
• Packing:               1000 class clean room in a single wafer container           

   Typical Properties

•  Crystal Structure:                                 cubic a = 6.095 ??0‡3
• Density:                                                 5.619 g/cm³
• Melting point:                                        710 ^oC
• Grown by a special LEC technique , EPD :<10000/cm²
• Thermal Expansion:                           6.1 x 10 ^-6 /oK
• Thermal conductivity:                          270 mW / cm.k   at 300K

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