Ge Wafer Specification

• Growing Method:            CZ
• Wafer Size:                    5 x 5 x0.5 mm
• Surface Polishing:          one  side epi polished
• Orientation:                    (100)
• Surface roughness:        RMS or Ra:~ 10 A(By AFM)
• Doping:                           Ga doped
• Conductor type:              P-type
• Resistivity:                     1-5 Ohms/cm  (If you would like to measure the resistivity accurately,
                                       please order our Portable 4 Probe Resistivity Testing Instrument.)              
• Package:                        under 1000 class clean room  in wafer container     
  
  

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