Ge Wafer Specification

• Growing Method:              CZ
• Orientation:                      (100) +/-0.5 Deg.
• Wafer Size:                      2" dia x  500 microns  
• Surface Polishing:             One side epi polished
• Surface roughness:           < 8 A ( by AFM)
• Doping:                            Ga Doped
• Conductor type:                P-type
• Resistivity:                       0.0007-0.002 ohm-cm (If you would like to measure the resistivity accurately, 
                                        please order our Portable 4 Probe Resistivity Testing Instrument.)                   
• Package:                         under 1000 class clean room      

Typical Properties:

• Structure:                        Cubic, a = 5.6754 Å
• Density:                          5.323 g/cm3 at room temperature
• Melting Point:                  937.4 ^oC
• Thermal Conductivity:       640