Ge Wafer Specification

• Growing Method:                   CZ
• Orientation:                            (111) +/-0.5 Deg.
• Wafer Size:                            2" dia x  500 microns  
• Surface Finish(RMS or Ra):   one side epi polished < 8 A ( by AFM)
• Doping:                                 Undoped
• Conductor type:                    N-type
• Resistivity:                              >50  Ohms/cm (If you would like to measure the resistivity accurately, 
                                                please order our Portable 4 Probe Resistivity Testing Instrument.)                             
• Package:                               under 1000 class clean room      

Typical Properties:

• Structure:                        Cubic, a = 5.6754 Å
• Density:                          5.323 g/cm3 at room temperature
• Melting Point:                  937.4 ^oC
• Thermal Conductivity:       640