KMg3(AlSi3O10)F2 -Synthetized fluorphlogopite, 20x20 x0.3 mm t, as cleaved - CmMICAKMg3AlSi3O10F2202003
KMg3(AlSi3O10)F2 -Synthetized fluorphlogopite, 20x20 x0.3 mm t, as cleaved - CmMICAKMg3AlSi3O10F2202003
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SKU: : \CmMICAKMg3AlSi3O10F2202003
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Synthetic fluorophlogopite is obtained by cooling and devitrification of chemical raw materials by high-temperature melting. The single wafer fraction is KMg3(AlSi3O10)F2, which belongs to the monoclinic system and is a typically layered silicate.
KMg3(AlSi3O10)F2 is a typical layered silicate. Many of its properties are superior to natural mica. For example, when the temperature is higher than 1200°C, the volume resistivity of synthetic fluorophlogopite is 1000 times higher than that of natural mica under high-temperature conditions. The electrical insulation is good, and the vacuum is very low at high temperatures. As well as being resistant to acids, alkalis, transparent, separable and flexible, it is an important non-metallic insulating material for modern industries and high-tech industries such as motors, electrical appliances, electronics, and aviation.
- KMg3(AlSi3O10)F2 -synthetized fluorophlogopite
- Size: 20 mm x 20 mm
- Thickness: 0.3 mm
- Surface Finish: as cleaved
| Density | 2.78~2.85 * 10^3 kg/m^3 | |
| Volume Resistivity | 10^15~10^16 Ω·cm | |
| Surface Resistivity | 10^11~10^13 Ω | |
| Dielectric Strength | 185~236kV/mm | |
| Permittivity | 5.6 ε | |
| dielectric loss | 1~4x 10^-4 tg δ | |
| Melting Point | 1375 ± 5 | |
| Max Working Temperature(Tmax) | 1100 | |
| Thermal Weight Loss (40 ~ 1180 | 0.85% | |
| Specific heat capacity | 836 J/kg · K | |
| Linear Thermal Expansion | () 10 ~ 12 x 10^-6/K | |
| (⊥) 15 ~ 25 x 10^-6/K | ||
| Thermal conductivity | () 3.75W/m·K | |
| (⊥) 0.55W/m·K | ||
| optical axial angle | 8° ~ 14° | |
| Hardness | Mohs Hardness | 3~3.4 |
| Microhardness Hv0.2 | 1.35GPa | |
| S | 138~146 | |
| refractive index | N_p | 1.513~1.544 |
| N_m | 1.539~1.564 | |
| N_g | 1.540~1.566 | |
| Ultimate tensile strength | 150~200MPa | |
| Compressive strength | 400~520MPa | |
| Water absorption | 0.14~0.23% | |
| Moisture absorption | 0~0.05% | |
| Mosaicity | < 0.25 | |
Coefficient of Linear Thermal Expansion (x10^-6/K)
| Temperature | 200 | 600 | 900 |
| Cleavage | 10.0 | 6.3 | 2.96 |
| ⊥ Cleavage | 21.2 | 11.5 | 5.08 |
Volume Resistivity Under High Temperature (Ω·cm)
| Temperature | Room temperature | 300 | 500 | 600 | 700 | 800 |
| Volume Resistivity | 3.9 x 10^15 | 5.1 x 10^13 | 1.6 x 10^13 | 1.6 x 10^12 | 5.6x10^11 | 3.9x10^10 |
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