Specifications of Substrate

• Orientation: <0001> with 4 degree off toward <11-20>
• Dimension: 10 x 10 x 0.33 +/-0.03 mm
• Polished: One sides epi polished on Si face
• Surface Roughness: < 10 A by AFM

Typical Properties of Single Crystal SiC

• Formula weight: 40.10
• Unit Cell: Hexagonal
• Lattice constant: a =3.07 A c = 10.05 A
• Stacking sequence: ABCB (4H)
• Growth Technique: MOCVD
• Polishing : Silicon face polished
•  Band Gap: 3.26 eV ( Indirect)
• Conductivity type: N
• TTV/Bow/Warp: <=35um
• Micropipe Density: <=30 cm^-2
• Resistivity: 0.01~0.5 ohm-cm
• Dielectric Constant: e (11) = e (22) = 9.66 e (33) = 10.33
• Thermal Conductivity @ 300K: 5 W / cm . K
• Hardness: 9 Mohs
• Doping level of nitrogen atoms : 10^18-19 cm^-3

Other SiC	GaN	AlN template	ZnO
Sapphire	Dicing Saw	Wafer Containers	Film Coater