SOI Wafer: 6", 2.5 "m (P-doped ) + 1.0 SiO2 + 625um Si (P-type /Boron doped )
SOI Wafer: 6", 2.5 "m (P-doped ) + 1.0 SiO2 + 625um Si (P-type /Boron doped )
12 in stock
Regular price
$329.00 USD
Regular price
Sale price
$329.00 USD
Unit price
per
SKU: : \FmSOIa152D0625C1
PSpecifications
Device Layer |
||
Diameter: |
|
6" |
Type/Dopant: |
|
N type/P-doped |
Orientation: |
|
<1-0-0>+/-.5 degree |
Thickness: |
|
2.5±0.5µm |
Resistivity: |
|
1-4 ohm-cm |
Finish: |
Front Side Polished |
|
Buried Thermal Oxide: |
||
Thickness: |
|
1.0um +/- 0.1 um |
Handle Wafers: |
||
Type/Dopant |
P Type, B doped |
|
Orientation |
|
<1-0-0>+/-.5 degree |
Resistivity: |
|
10-20 ohm-cm |
Thickness: |
|
625 +/- 15 um |
Finish: |
|
As-received (not polished) |
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