Thermal Oxide Wafer: 500 nm SiO2 Layer on Si (100), 4"dia x 0.50 mm t, N-type ,P doped 1sp ,0.01-0.1 ohm.cm
Thermal Oxide Wafer: 500 nm SiO2 Layer on Si (100), 4"dia x 0.50 mm t, N-type ,P doped 1sp ,0.01-0.1 ohm.cm
Low stock: 3 left
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$109.95 USD
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$109.95 USD
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SKU: : \Fm500SOonSIPa100D0525C1R001US
Thermal oxide Layer
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Research Grade , about 80 % useful area
- SiO2 layer on 4" Silicon wafer
- Oxide layer thickness: 500 nm ( 5000A) +/-10%
- Refractive index - 1.455
Silicon Wafer Specifications:
- Conductive type: N-type/ P-dped
-
Resistivity: 0.01-0.1 ohm.cm (If you would like to measure the resistivity accurately,
please order our Portable 4 Probe Resistivity Testing Instrument.) - Size: 4" +/- 0.5 mm x 0.5 mm
- Orientation: (100) +/- 1o
- Polish: one side polished
- Surface roughness, Ra: < 5A (RMS)
-
Optional: you may need tool below to handle the wafer ( click picture to order )
Diamond Scriber for Cutting Single Crystal Substrate - DS-01
Micro-Fiber & Dust Free Wiper, 4"x4", 100 pcs/bag - Wiper-yx-2001
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