Compact Vacuum Hot Flat Press for Wafer Bonding (50x50mm Area, 500 Max 500Kg) - VHP-5000N2
Compact Vacuum Hot Flat Press for Wafer Bonding (50x50mm Area, 500 Max 500Kg) - VHP-5000N2
Low stock: 2 left
Price: RFQ
SKU: : \VHP-5000N2
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The VHP-5000N2 is a Compact Vacuum Hot Flat Press for wafer welding or film transfer. The maximum sample size is 50mm x 50mm x 15mm. The superior performance of the equipment is very suited for sintered bonding research of third-generation semiconductor devices. The maximum operating temperature is 500 ° C and the maximum pressure is 5000N. It is fully satisfied with the need for packaging interconnection materials in the process of semiconductor preparation. The vacuum and atmosphere environment provided by it can reduce the oxidation of materials as much as possible. It is a very cost-effective laboratory R & D equipment.
Specifications
Power |
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Heating Plates |
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Temp. Controller |
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Pressing System |
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Vacuum Chamber |
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(Optional) Chilled Water and Vacuum Generation (Required but not included) |
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Warning |
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Operation Video
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